Description
No descriptionConfiguration
HBK 07 Bondhead (backcut) with active knife, 60 kHz transducer Ribbon size: 0.075 x 0.75 mm to 0.3 x 2 mm Wire diameter range: 100 µm to 500 µm Working area 350mm x 500mm (13.8" x 19.7") Bondheads for thick wire and ribbon applications Repeatability of the axes: 2 μm at 3 Sigma Wire spool, 4", motor driven Wire control and wire consumption measurement Active cutting system 4-Axis (X, Y, Z Theta) (3) Linear motors (2) Brushless servomotors Mini CCD camera with optics unit TFT Monitor High-res automatic image processing system 32-Bit digital I/O interface, electrically isolated, 24 V Keyboard and trackball Quality controller Microscope Enclosure incl. security system Bonding process: Aluminum Gold Copper wire Consumables: (4) Wedge tools for 200μm wires (50) Wire guides (9) Backcuts Power supply: 230 V, 50/60 HzOEM Model Description
Introducing Bondjet BJ939: Fully Automatic Heavy Wire Bonders by Hesse GmbH, equipped with unique features. Non-destructive pull test & transducer sensor ensure real-time quality monitoring. High speed, largest bonding area, and advanced programmable features enhance productivity. Up to 3 wires/s, 2 μm at 3 σ repeatability, and integrated quality control for precise results.Documents
No documents
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: 14 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
145514
Wafer Sizes:
Unknown
Vintage:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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HESSE & KNIPPS
BONDJET 939
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: 14 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
145514
Wafer Sizes:
Unknown
Vintage:
2014
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
HBK 07 Bondhead (backcut) with active knife, 60 kHz transducer Ribbon size: 0.075 x 0.75 mm to 0.3 x 2 mm Wire diameter range: 100 µm to 500 µm Working area 350mm x 500mm (13.8" x 19.7") Bondheads for thick wire and ribbon applications Repeatability of the axes: 2 μm at 3 Sigma Wire spool, 4", motor driven Wire control and wire consumption measurement Active cutting system 4-Axis (X, Y, Z Theta) (3) Linear motors (2) Brushless servomotors Mini CCD camera with optics unit TFT Monitor High-res automatic image processing system 32-Bit digital I/O interface, electrically isolated, 24 V Keyboard and trackball Quality controller Microscope Enclosure incl. security system Bonding process: Aluminum Gold Copper wire Consumables: (4) Wedge tools for 200μm wires (50) Wire guides (9) Backcuts Power supply: 230 V, 50/60 HzOEM Model Description
Introducing Bondjet BJ939: Fully Automatic Heavy Wire Bonders by Hesse GmbH, equipped with unique features. Non-destructive pull test & transducer sensor ensure real-time quality monitoring. High speed, largest bonding area, and advanced programmable features enhance productivity. Up to 3 wires/s, 2 μm at 3 σ repeatability, and integrated quality control for precise results.Documents
No documents