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Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The ASM Twin Eagle Xtreme is an advanced wedge bonder that offers enhanced capabilities compared to the standard Xtreme model, delivering higher output per floor space. It is specifically designed to cater to the consumer products market by providing fast and flexible solutions at a cost-effective level. This system is equipped to handle flip chip processes, allowing for the application of gold or copper stud bumps on wafers up to 300mm in diameter. With its improved speed and versatility, the Twin Eagle Xtreme is a valuable tool for meeting the demands of modern semiconductor manufacturing.Documents
No documents
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
13896
Wafer Sizes:
Unknown
Vintage:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASM
TWIN EAGLE XTREME
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
13896
Wafer Sizes:
Unknown
Vintage:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The ASM Twin Eagle Xtreme is an advanced wedge bonder that offers enhanced capabilities compared to the standard Xtreme model, delivering higher output per floor space. It is specifically designed to cater to the consumer products market by providing fast and flexible solutions at a cost-effective level. This system is equipped to handle flip chip processes, allowing for the application of gold or copper stud bumps on wafers up to 300mm in diameter. With its improved speed and versatility, the Twin Eagle Xtreme is a valuable tool for meeting the demands of modern semiconductor manufacturing.Documents
No documents