Skip to main content
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon
ASM TWIN EAGLE XTREME
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The ASM Twin Eagle Xtreme is an advanced wedge bonder that offers enhanced capabilities compared to the standard Xtreme model, delivering higher output per floor space. It is specifically designed to cater to the consumer products market by providing fast and flexible solutions at a cost-effective level. This system is equipped to handle flip chip processes, allowing for the application of gold or copper stud bumps on wafers up to 300mm in diameter. With its improved speed and versatility, the Twin Eagle Xtreme is a valuable tool for meeting the demands of modern semiconductor manufacturing.
    Documents

    No documents

    ASM

    TWIN EAGLE XTREME

    verified-listing-icon

    Verified

    CATEGORY
    Wire / Wedge / Ball Bonder

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    13896


    Wafer Sizes:

    Unknown


    Vintage:

    2010


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    ASM TWIN EAGLE XTREME

    ASM

    TWIN EAGLE XTREME

    Wire / Wedge / Ball Bonder
    Vintage: 2010Condition: Used
    Last VerifiedOver 60 days ago

    ASM

    TWIN EAGLE XTREME

    verified-listing-icon
    Verified
    CATEGORY
    Wire / Wedge / Ball Bonder
    Last Verified: Over 60 days ago
    listing-photo-8isQeaUTqQwn-o6brt0FjfuMPanNFWi5ZGS41li-BL4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1097/13896/da8caf5a11764f528e857df380875aa4_moov1_m.jpeg
    listing-photo-8isQeaUTqQwn-o6brt0FjfuMPanNFWi5ZGS41li-BL4-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1097/13896/7346639713b24054b4055d8ce97fa549_moov6_m.jpeg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    13896


    Wafer Sizes:

    Unknown


    Vintage:

    2010


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The ASM Twin Eagle Xtreme is an advanced wedge bonder that offers enhanced capabilities compared to the standard Xtreme model, delivering higher output per floor space. It is specifically designed to cater to the consumer products market by providing fast and flexible solutions at a cost-effective level. This system is equipped to handle flip chip processes, allowing for the application of gold or copper stud bumps on wafers up to 300mm in diameter. With its improved speed and versatility, the Twin Eagle Xtreme is a valuable tool for meeting the demands of modern semiconductor manufacturing.
    Documents

    No documents

    Similar Listings
    View All
    ASM TWIN EAGLE XTREME

    ASM

    TWIN EAGLE XTREME

    Wire / Wedge / Ball BonderVintage: 2010Condition: UsedLast Verified:Over 60 days ago