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Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME bonder that offers additional features and capabilities. Wire BonderDocuments
No documents
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
76748
Wafer Sizes:
Unknown
Vintage:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
EAGLE XTREME GOCU
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
76748
Wafer Sizes:
Unknown
Vintage:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The ASMPT EAGLE XTREME GOCU is an advanced semiconductor bonder developed by ASM Pacific Technology (ASMPT), a leading supplier of semiconductor assembly and packaging equipment. The EAGLE XTREME GOCU model is an enhanced version of the EAGLE XTREME bonder that offers additional features and capabilities. Wire BonderDocuments
No documents