Description
ASM TECH - GOLD WIRE BALL BONDERConfiguration
No ConfigurationOEM Model Description
The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.Documents
No documents
Verified
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: 6 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
152910
Wafer Sizes:
Unknown
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
Eagle AERO
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: 6 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
152910
Wafer Sizes:
Unknown
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
ASM TECH - GOLD WIRE BALL BONDERConfiguration
No ConfigurationOEM Model Description
The Eagle AERO opens a new dimension in high-end IC applications. Thanks to its innovative bonding process (X-Power), copper wire connections can be generated 30 percent faster than with previous bonders. The Eagle AERO can create up to 24 2-millimeter connections per second with a bonding accuracy to 2,0 μm at 3 σ and a ball size that can be reduced to 22 μm.Documents
No documents