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Description
WIRE BONDERConfiguration
No ConfigurationOEM Model Description
The Eagle 60 is a wire bonder from ASM that is capable of ultra-fine pitch bonding for advanced ball grid array (BGA) devices.Documents
No documents
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112874
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ASM
EAGLE 60
CATEGORY
Wire / Wedge / Ball Bonder
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112874
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
WIRE BONDERConfiguration
No ConfigurationOEM Model Description
The Eagle 60 is a wire bonder from ASM that is capable of ultra-fine pitch bonding for advanced ball grid array (BGA) devices.Documents
No documents