Description
No descriptionConfiguration
Details attached.OEM Model Description
The EXPEDIUS™ + is designed for 45nm and beyond technology node and has improved upon its predecessor in both performance and productivity. The configuration of the chemical treatment tanks, pure water rinse tanks, and dryer has been optimized to support FEOL clean, which requires particularly stringent process performance. Standard installation of the new SD2 dryer enables significant reduction of 45nm size or less micro-particles. The new SD2 which has been improved from TEL's original IPA dry module decreases the surface tension and prevents pattern destruction of vulnerable structures on the wafer. Furthermore the EXPEDIUS™ + provides high throughput and excellent productivity through a new wafer transportation system with smaller footprint. In addition, its unique batch-formation software option enhances process efficiency regardless of wafer quantity and processing position.Documents
TEL / TOKYO ELECTRON
EXPEDIUS +
Verified
CATEGORY
Wet processing
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
31305
Wafer Sizes:
12"/300mm
Vintage:
2007
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
EXPEDIUS +
Verified
CATEGORY
Wet processing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
31305
Wafer Sizes:
12"/300mm
Vintage:
2007
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Details attached.OEM Model Description
The EXPEDIUS™ + is designed for 45nm and beyond technology node and has improved upon its predecessor in both performance and productivity. The configuration of the chemical treatment tanks, pure water rinse tanks, and dryer has been optimized to support FEOL clean, which requires particularly stringent process performance. Standard installation of the new SD2 dryer enables significant reduction of 45nm size or less micro-particles. The new SD2 which has been improved from TEL's original IPA dry module decreases the surface tension and prevents pattern destruction of vulnerable structures on the wafer. Furthermore the EXPEDIUS™ + provides high throughput and excellent productivity through a new wafer transportation system with smaller footprint. In addition, its unique batch-formation software option enhances process efficiency regardless of wafer quantity and processing position.Documents
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