Description
Batch Wafer Processing Application: Pre Diffusion CleanConfiguration
Bath-1: SPM Operating: 110 - 150°C, H2SO4/H2O2 (3:1), circulation Chemical spiking: auto concentration feedback Bath Material: Quartz Bath-2: QDR (hot) Operating: DIW rinse (75°C, 40 – 80 L/min) Injection: H2O2/NH4OH Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Bath-3: APM Operating: 35 - 85°C, NH4OH/H2O2/DIW (1:1:15), 15 L/min, circulation Chemical spiking: auto concentration feedback Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Bath-4: POU Operating: 70°C, NH4OH/H2O2 DIW Shower (hot / cold) Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Dryer: SD2*2 Operating: 49% DHF (1:200), IPA/N2 200°C, 100 L/min Resistivity monitoring (Horiba) Bath Material: PTFEOEM Model Description
The EXPEDIUS™ + is designed for 45nm and beyond technology node and has improved upon its predecessor in both performance and productivity. The configuration of the chemical treatment tanks, pure water rinse tanks, and dryer has been optimized to support FEOL clean, which requires particularly stringent process performance. Standard installation of the new SD2 dryer enables significant reduction of 45nm size or less micro-particles. The new SD2 which has been improved from TEL's original IPA dry module decreases the surface tension and prevents pattern destruction of vulnerable structures on the wafer. Furthermore the EXPEDIUS™ + provides high throughput and excellent productivity through a new wafer transportation system with smaller footprint. In addition, its unique batch-formation software option enhances process efficiency regardless of wafer quantity and processing position.Documents
No documents
Verified
CATEGORY
Wet Benches - Auto
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
20854
Wafer Sizes:
12"/300mm
Vintage:
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View All
TEL / TOKYO ELECTRON
EXPEDIUS +
CATEGORY
Wet Benches - Auto
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
20854
Wafer Sizes:
12"/300mm
Vintage:
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Batch Wafer Processing Application: Pre Diffusion CleanConfiguration
Bath-1: SPM Operating: 110 - 150°C, H2SO4/H2O2 (3:1), circulation Chemical spiking: auto concentration feedback Bath Material: Quartz Bath-2: QDR (hot) Operating: DIW rinse (75°C, 40 – 80 L/min) Injection: H2O2/NH4OH Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Bath-3: APM Operating: 35 - 85°C, NH4OH/H2O2/DIW (1:1:15), 15 L/min, circulation Chemical spiking: auto concentration feedback Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Bath-4: POU Operating: 70°C, NH4OH/H2O2 DIW Shower (hot / cold) Bath Material: PTFE Megasonic: 950 kHz, 2400W (600*4) Dryer: SD2*2 Operating: 49% DHF (1:200), IPA/N2 200°C, 100 L/min Resistivity monitoring (Horiba) Bath Material: PTFEOEM Model Description
The EXPEDIUS™ + is designed for 45nm and beyond technology node and has improved upon its predecessor in both performance and productivity. The configuration of the chemical treatment tanks, pure water rinse tanks, and dryer has been optimized to support FEOL clean, which requires particularly stringent process performance. Standard installation of the new SD2 dryer enables significant reduction of 45nm size or less micro-particles. The new SD2 which has been improved from TEL's original IPA dry module decreases the surface tension and prevents pattern destruction of vulnerable structures on the wafer. Furthermore the EXPEDIUS™ + provides high throughput and excellent productivity through a new wafer transportation system with smaller footprint. In addition, its unique batch-formation software option enhances process efficiency regardless of wafer quantity and processing position.Documents
No documents