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EVGroup (EVG) EVG301
    Description
    Wafer Cleaner
    Configuration
    No Configuration
    OEM Model Description
    The EVG301 semi-automated single wafer cleaning system employs one cleaning station, which cleans wafers using standard DI-water rinse as well as megasonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding. Spinner chucks are available for different wafer and substrate sizes to allow easy setup for different processes.
    Documents

    No documents

    EVGroup (EVG)

    EVG301

    verified-listing-icon

    Verified

    CATEGORY
    Wet processing

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    37955


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown

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    Money Back Guarantee
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    Transaction Insured by Moov
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    Refurbishment Services
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    EVGroup (EVG) EVG301

    EVGroup (EVG)

    EVG301

    Wet processing
    Vintage: 0Condition: Used
    Last Verified2 days ago

    EVGroup (EVG)

    EVG301

    verified-listing-icon
    Verified
    CATEGORY
    Wet processing
    Last Verified: Over 60 days ago
    listing-photo-1652920aab114a4093e04cd809354663-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    37955


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Wafer Cleaner
    Configuration
    No Configuration
    OEM Model Description
    The EVG301 semi-automated single wafer cleaning system employs one cleaning station, which cleans wafers using standard DI-water rinse as well as megasonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding. Spinner chucks are available for different wafer and substrate sizes to allow easy setup for different processes.
    Documents

    No documents

    Similar Listings
    View All
    EVGroup (EVG) EVG301

    EVGroup (EVG)

    EVG301

    Wet processingVintage: 0Condition: UsedLast Verified: 2 days ago
    EVGroup (EVG) EVG301

    EVGroup (EVG)

    EVG301

    Wet processingVintage: 0Condition: UsedLast Verified: 2 days ago
    EVGroup (EVG) EVG301

    EVGroup (EVG)

    EVG301

    Wet processingVintage: 0Condition: UsedLast Verified: Over 60 days ago