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LAM RESEARCH / SEZ DV-34BF
    Description
    Single Wafer Processing
    Configuration
    Process: SWC   Tool config is based on original PO, please verify tool details at tool inspection   Chamber R1 & Chamber R2 & Chamber L1 & Chamber L2 Mde. 1:49%HF Med. 2: Poly DI Dispenser N2 Dispemser: Bronkhost Mass Flow Contriller Chuck N2 MFC Chuck: Advanced Pin Chuck   Medium1 Chemical: HF(49%) Temperature control: B&R controller, Inlineheater Lufran 6KW*2 Circulation pump: :evitronix BPS-3 Filter: Entegris Concentration Monditor: NA   Medium2 Chemical: Poly Temperature control: B&R controller, Inlineheater Lufran 6KW Circulation pump: Levitronix BPS-3 Filter: Entegris Concentration Monditor: Horiba CS-100 series                                                    Damage/Missing parts list Please inspect tool to reconfirm
    OEM Model Description
    The DV-34BF is part of the Da Vinci Series, a single-wafer processing technology platform designed for high-volume manufacturing. It addresses new cleaning requirements for polymer removal and backside etch and clean, providing high-throughput and accurate wafer cleaning to maximize device yields. The four-chamber system performs a wide range of back-and frontside processes on 300 mm wafers and is optimized for emerging technologies such as high-k dielectrics, new metal gates, and non-volatile memory devices. It offers optimized process performance, high throughput, minimized footprint, advanced handling, reduced media consumption, flexible chemistry application, higher reliability, resulting in low CoO.
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    LAM RESEARCH / SEZ

    DV-34BF

    verified-listing-icon

    Verified

    CATEGORY

    Wet Etch
    Last Verified: 26 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    22980


    Wafer Sizes:

    12"/300mm


    Vintage:

    2007

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    LAM RESEARCH / SEZ DV-34BF
    LAM RESEARCH / SEZDV-34BFWet Etch
    Vintage: 2007Condition: Used
    Last Verified19 days ago

    LAM RESEARCH / SEZ

    DV-34BF

    verified-listing-icon

    Verified

    CATEGORY

    Wet Etch
    Last Verified: 26 days ago
    listing-photo-xSEeUU88AIkyqump8pYCuFUD7jVvpXX_uiDV7MoEDpM-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    22980


    Wafer Sizes:

    12"/300mm


    Vintage:

    2007


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Single Wafer Processing
    Configuration
    Process: SWC   Tool config is based on original PO, please verify tool details at tool inspection   Chamber R1 & Chamber R2 & Chamber L1 & Chamber L2 Mde. 1:49%HF Med. 2: Poly DI Dispenser N2 Dispemser: Bronkhost Mass Flow Contriller Chuck N2 MFC Chuck: Advanced Pin Chuck   Medium1 Chemical: HF(49%) Temperature control: B&R controller, Inlineheater Lufran 6KW*2 Circulation pump: :evitronix BPS-3 Filter: Entegris Concentration Monditor: NA   Medium2 Chemical: Poly Temperature control: B&R controller, Inlineheater Lufran 6KW Circulation pump: Levitronix BPS-3 Filter: Entegris Concentration Monditor: Horiba CS-100 series                                                    Damage/Missing parts list Please inspect tool to reconfirm
    OEM Model Description
    The DV-34BF is part of the Da Vinci Series, a single-wafer processing technology platform designed for high-volume manufacturing. It addresses new cleaning requirements for polymer removal and backside etch and clean, providing high-throughput and accurate wafer cleaning to maximize device yields. The four-chamber system performs a wide range of back-and frontside processes on 300 mm wafers and is optimized for emerging technologies such as high-k dielectrics, new metal gates, and non-volatile memory devices. It offers optimized process performance, high throughput, minimized footprint, advanced handling, reduced media consumption, flexible chemistry application, higher reliability, resulting in low CoO.
    Documents

    No documents

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