Description
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Process: Pre-diffusion clean HF (50:1) POU SC-1 HQDR SC-2 HQDR SD2 DryerOEM Model Description
The UW200Z is a state-of-the-art automated wet station designed for advanced front-end-of-line (FEOL) cleans, etch, and resist strip in 300mm and 200mm wafer mass production environments. It achieves high productivity through reduced dry time and the ability to process multiple chemistries in a single point-of-use bath. The system is also designed for low cost of ownership, with reduced requirements for deionized water, chemicals, and exhaust. It is compliant with SECS/GEM host communication, S2-0200 and CE mark compliance, and FM compliance. The UW200Z also features a stacked dual chamber dryer (SD2) with in-situ chemical injection for process flexibility and watermark-less drying performance. Overall, the UW200Z offers a versatile and efficient solution for advanced wafer processing.Documents
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TEL / TOKYO ELECTRON
UW-200Z
Verified
CATEGORY
Wet Benches - Auto
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
36804
Wafer Sizes:
Unknown
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
UW-200Z
CATEGORY
Wet Benches - Auto
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
36804
Wafer Sizes:
Unknown
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Process: Pre-diffusion clean HF (50:1) POU SC-1 HQDR SC-2 HQDR SD2 DryerOEM Model Description
The UW200Z is a state-of-the-art automated wet station designed for advanced front-end-of-line (FEOL) cleans, etch, and resist strip in 300mm and 200mm wafer mass production environments. It achieves high productivity through reduced dry time and the ability to process multiple chemistries in a single point-of-use bath. The system is also designed for low cost of ownership, with reduced requirements for deionized water, chemicals, and exhaust. It is compliant with SECS/GEM host communication, S2-0200 and CE mark compliance, and FM compliance. The UW200Z also features a stacked dual chamber dryer (SD2) with in-situ chemical injection for process flexibility and watermark-less drying performance. Overall, the UW200Z offers a versatile and efficient solution for advanced wafer processing.Documents
No documents