6033T
Category
Wafer TestingOverview
The Model 6033T, using ADE’s patented capacitive measurement principle, measures wafers for Thickness and Total Thickness Variation (TVV). Whenever semiconductor wafer inspection is required, the MicroSense Model 6033T offers a low cost method of achieving fast, accurate measurements on wafers up to 150mm in diameter.
Active Listings
3
Services
Inspection, Insurance, Appraisal, Logistics
