Description
Bonding Accuracy Defect DetectorConfiguration
No ConfigurationOEM Model Description
The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy. Because of the system’s high measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters. With its diverse measurement methods, the EVG40 NT adapts to a large number of manufacturing processes like nanoimprint lithography or wafer-to-wafer bonding simultaneously.Documents
No documents
Verified
CATEGORY
Wafer Testing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127034
Wafer Sizes:
Unknown
Vintage:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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EVGroup (EVG)
EVG40 NT
CATEGORY
Wafer Testing
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127034
Wafer Sizes:
Unknown
Vintage:
2013
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Bonding Accuracy Defect DetectorConfiguration
No ConfigurationOEM Model Description
The EVG40 NT (stand-alone tool) and the AVM (HVM-integrated module) enable measurement of lithography-relevant parameters like critical dimensions, as well as bond alignment accuracy. Because of the system’s high measurement accuracy, it is possible to verify compliance to tight process specifications and instantly optimize integrated process parameters. With its diverse measurement methods, the EVG40 NT adapts to a large number of manufacturing processes like nanoimprint lithography or wafer-to-wafer bonding simultaneously.Documents
No documents