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Description
No descriptionConfiguration
-Fully automated, dry-in/dry-out single wafer SiC substrate polisher -Configured for 150mm wafer processing -Milara, edge-contact dry robot on linear transfer platform -3 polish modules equipped with dedicated hardware -22" polish tables for constant-flow polish process -High pressure spray bar pad cleaner -Overam spindle with 4 passage rotary union -Slurry flow-controller for 2 lines per table -Integrated spray clean module with Jetspray and 2 fluid lines -Wet wafer transfer module with edge grip wafer flip robot to return wafer orientation to polish side up for cleaning -PEER Group, Windows based software architecture on a Beckhoff PLC control system with wafer lot and slot integrity -Semi S2, S8 and CE certification -Table temperture control unit -Universal Vacuum System -OCR camera -200mm wafer size conversion kit -6EZ Spare Parts KitOEM Model Description
None ProvidedDocuments
No documents
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
108406
Wafer Sizes:
Unknown
Vintage:
2020
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
REVASUM
6EZ
CATEGORY
Wafer Polishing
Last Verified: 28 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
108406
Wafer Sizes:
Unknown
Vintage:
2020
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
-Fully automated, dry-in/dry-out single wafer SiC substrate polisher -Configured for 150mm wafer processing -Milara, edge-contact dry robot on linear transfer platform -3 polish modules equipped with dedicated hardware -22" polish tables for constant-flow polish process -High pressure spray bar pad cleaner -Overam spindle with 4 passage rotary union -Slurry flow-controller for 2 lines per table -Integrated spray clean module with Jetspray and 2 fluid lines -Wet wafer transfer module with edge grip wafer flip robot to return wafer orientation to polish side up for cleaning -PEER Group, Windows based software architecture on a Beckhoff PLC control system with wafer lot and slot integrity -Semi S2, S8 and CE certification -Table temperture control unit -Universal Vacuum System -OCR camera -200mm wafer size conversion kit -6EZ Spare Parts KitOEM Model Description
None ProvidedDocuments
No documents