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Description
Multi-Process CMPConfiguration
Standard Features Include: - Automated control with soft touch key pad - Two platen process for post polish buff - Multiple slurry dispense - In-situ pad conditioner - Material compatibility for medium and low ph slurries (1 – 12) - Down force up to 750lbs. - Controllable wafer back pressure - Polish head clean station - External interface for end point capability Optional Features - Multizone ViPRR carrier upgrade - Temperature controlled platens - SECS II InterfaceOEM Model Description
None ProvidedDocuments
No documents
Verified
CATEGORY
Wafer Polishing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
83267
Wafer Sizes:
8"/200mm
Vintage:
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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IPEC / WESTECH
AVANTI 372M
CATEGORY
Wafer Polishing
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
83267
Wafer Sizes:
8"/200mm
Vintage:
1997
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Multi-Process CMPConfiguration
Standard Features Include: - Automated control with soft touch key pad - Two platen process for post polish buff - Multiple slurry dispense - In-situ pad conditioner - Material compatibility for medium and low ph slurries (1 – 12) - Down force up to 750lbs. - Controllable wafer back pressure - Polish head clean station - External interface for end point capability Optional Features - Multizone ViPRR carrier upgrade - Temperature controlled platens - SECS II InterfaceOEM Model Description
None ProvidedDocuments
No documents