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CHAD WLM-2300
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The CHAD Wafer Loader WLM™ Series delivers significant performance and cost savings for wafer level packaging applications. This system provides fully automated wafer handling for back-end of line (BEOL) process and metrology tools. The WLM series can handle a wide range of wafer sizes (up to 300mm in diameter), wafers with active devices on both sides, thin wafers, and other types of non-standard substrates. Other features include a configurable flow direction (left or right); an ergonomic cassette elevator; various types of cassette I/O, as well as OCR and barcode reading options.
    Documents

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    CHAD

    WLM-2300

    verified-listing-icon

    Verified

    CATEGORY
    Wafer Handling

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    98166


    Wafer Sizes:

    Unknown


    Vintage:

    2005

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    CHAD WLM-2300

    CHAD

    WLM-2300

    Wafer Handling
    Vintage: 2005Condition: Used
    Last VerifiedOver 60 days ago

    CHAD

    WLM-2300

    verified-listing-icon
    Verified
    CATEGORY
    Wafer Handling
    Last Verified: Over 60 days ago
    listing-photo-c86acb195e754bbab2a0eb1b4377172b-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    98166


    Wafer Sizes:

    Unknown


    Vintage:

    2005


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The CHAD Wafer Loader WLM™ Series delivers significant performance and cost savings for wafer level packaging applications. This system provides fully automated wafer handling for back-end of line (BEOL) process and metrology tools. The WLM series can handle a wide range of wafer sizes (up to 300mm in diameter), wafers with active devices on both sides, thin wafers, and other types of non-standard substrates. Other features include a configurable flow direction (left or right); an ergonomic cassette elevator; various types of cassette I/O, as well as OCR and barcode reading options.
    Documents

    No documents

    Similar Listings
    View All
    CHAD WLM-2300

    CHAD

    WLM-2300

    Wafer HandlingVintage: 2005Condition: UsedLast Verified: Over 60 days ago