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UH-I-8800
Category
Wafer GrindingOverview
Edge grinder for 4" to 8" substrate, which enables accurate direction of orientation flat. UH-I-8800 is a high throughput model by 2 axes of grinding wheels. -2 cassettes, C-to-C handling -UH-I-8800 is high performance model with 2 axes grinding wheels.
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