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GNX200BH
Category
Wafer GrindingOverview
The OKAMOTO GNX200BH is a fully automated wafer grinding machine designed for processing hard materials such as silicon carbide (SiC) and gallium nitride (GaN). It features dual grinding spindles with enhanced rigidity, a 6.7 kW spindle motor, and a three-disc worktable, enabling precise thinning and polishing of wafers.
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