 Okamoto developed the semiconductor back-grinding machine GNX-300 for super slim 300mm (12 inches) silicon weaher.

OKAMOTO

GNX-300

Okamoto gnx300 12 inch wafer back ultra-thin grinding and thinning equipment, with new color and high precision in 2005. The company has a professional service team to provide after-sales machine spare parts maintenance services. 

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6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

6" Fab For Sale from Moov - Click Here to Learn More

GNX-300

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OKAMOTO

GNX-300

OKAMOTO

GNX-300

OKAMOTO

GNX-300

OKAMOTO

GNX-300

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