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R631DF
Category
Wafer GrindingOverview
The KOYO R631DF is a specialized grinding machine designed for processing hard and brittle wafers, such as silicon carbide (SiC) and composite materials. It serves as an alternative to traditional lapping machines, offering high-precision grinding capabilities. The R631DF features fully automated cassette-to-cassette operation, allowing for the storage of grinding parameters for each wafer.
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