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DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
  • DISCO DFG8360
Description
12" model was imported as a new machine. Later it was converted to 8" model. Now it is in operation as a Ф8" dedicated machine
Configuration
No Configuration
OEM Model Description
The DISCO DFG8360 is a fully automatic in-feed surface grinder designed for precision thinning of semiconductor wafers. It features a two-spindle, two-chuck table configuration, enabling efficient grinding of wafers up to 8 inches in diameter. The grinder employs a diamond wheel with a diameter of 200 mm and operates with a spindle rated at 4.2 kW, offering a rotation speed range of 1,000 to 7,000 rpm. Its compact design measures 1,200 mm in width, 2,670 mm in depth, and 1,800 mm in height, with an approximate weight of 3,100 kg.
Documents

No documents

verified-listing-icon

Verified

CATEGORY
Wafer Grinding

Last Verified: Over 30 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

120971


Wafer Sizes:

8"/200mm


Vintage:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

DISCO

DFG8360

verified-listing-icon
Verified
CATEGORY
Wafer Grinding
Last Verified: Over 30 days ago
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Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

120971


Wafer Sizes:

8"/200mm


Vintage:

2006


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
12" model was imported as a new machine. Later it was converted to 8" model. Now it is in operation as a Ф8" dedicated machine
Configuration
No Configuration
OEM Model Description
The DISCO DFG8360 is a fully automatic in-feed surface grinder designed for precision thinning of semiconductor wafers. It features a two-spindle, two-chuck table configuration, enabling efficient grinding of wafers up to 8 inches in diameter. The grinder employs a diamond wheel with a diameter of 200 mm and operates with a spindle rated at 4.2 kW, offering a rotation speed range of 1,000 to 7,000 rpm. Its compact design measures 1,200 mm in width, 2,670 mm in depth, and 1,800 mm in height, with an approximate weight of 3,100 kg.
Documents

No documents