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Description
8" model was imported as a new machine. Now it is in operation as a 8" dedicated machine.Configuration
No ConfigurationOEM Model Description
The DISCO DFG8360 is a fully automatic in-feed surface grinder designed for precision thinning of semiconductor wafers. It features a two-spindle, two-chuck table configuration, enabling efficient grinding of wafers up to 8 inches in diameter. The grinder employs a diamond wheel with a diameter of 200 mm and operates with a spindle rated at 4.2 kW, offering a rotation speed range of 1,000 to 7,000 rpm. Its compact design measures 1,200 mm in width, 2,670 mm in depth, and 1,800 mm in height, with an approximate weight of 3,100 kg.Documents
No documents
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
120968
Wafer Sizes:
8"/200mm
Vintage:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
DISCO
DFG8360
CATEGORY
Wafer Grinding
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
120968
Wafer Sizes:
8"/200mm
Vintage:
2018
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
8" model was imported as a new machine. Now it is in operation as a 8" dedicated machine.Configuration
No ConfigurationOEM Model Description
The DISCO DFG8360 is a fully automatic in-feed surface grinder designed for precision thinning of semiconductor wafers. It features a two-spindle, two-chuck table configuration, enabling efficient grinding of wafers up to 8 inches in diameter. The grinder employs a diamond wheel with a diameter of 200 mm and operates with a spindle rated at 4.2 kW, offering a rotation speed range of 1,000 to 7,000 rpm. Its compact design measures 1,200 mm in width, 2,670 mm in depth, and 1,800 mm in height, with an approximate weight of 3,100 kg.Documents
No documents