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72/860
Category
Wafer GrindingOverview
The 72/860 is suitable for grinding of the lateral surfaces of squared mono- and multi crystalline silicon work pieces in the format 125 x 125 mm and 156 x 156 mm, with four parallelly arranged grinding aggregates (2x pre- and 2x fine grinding). Work piece lengths of 180 up to 1000 mm can be processed.
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