Description
Back GrinderConfiguration
No ConfigurationOEM Model Description
Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.Documents
No documents
ACCRETECH / TSK
PG300RM
Verified
CATEGORY
Wafer Grinding
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
111775
Wafer Sizes:
Unknown
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ACCRETECH / TSK
PG300RM
CATEGORY
Wafer Grinding
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
111775
Wafer Sizes:
Unknown
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Back GrinderConfiguration
No ConfigurationOEM Model Description
Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.Documents
No documents