Semiconductor manufacturing equipment: Probing machines, Dicing machines, Precision Blade, Polish grinders, Chemical mechanical planarizers (CMPs), Wafer slicing machines*, Wafer edge grinding machines*
Measuring instruments: Coordinate measuring machines, Surface texture and contour measuring instruments, Roundness and cylindrical profile measuring instruments, Optical measuring instrument, Machine control gauges*, Various types of sensors*

ACCRETECH / TOSEI

The W-GM-3000 is a Wafer Edge Grinding Machine that is designed to provide high precision grinding for both orientation flat and notch wafers. It features a TFT color LCD intelligent display that offers high operability and ease of use. With its advanced technology and user-friendly interface, the W-GM-3000 is a reliable and efficient tool for wafer edge grinding.

ACCRETECH / TOSEI

W-GM-3000

Wafer Grinding

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W-GM-3000

Wafer Grinding

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