Overview

The PG3000RMX is a Polish Grinder manufactured by ACCRETECH - TOKYO SEIMITSU. It is designed for simultaneous thinning and defect removal of wafers up to 300 mm. It performs the processes of rough grinding, fine grinding, polishing, and cleaning wafers on both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table. It has a high throughput for 15 µm wafer thinning in high volume production.