Description

Manual Wafer Load Wafer Bonder

Configuration

- Piston Force: 20kN Max. - Vacuum down to 5x10e-5 mbar. - Overpressure control with 3 bar max - Bonding in controlled environment - Flexible process control using a Windows operating environment with data recording and analysis - Bond Types capable: Silicon Fusion, Adhesive, Thermal Compression, Glass Fritt - Temperature Control to 500 degrees C - Top and Bottom Heaters - Turbo Pump - Operating Manual

OEM Model Description

The SB8e and the SB6e (SB8e/6e) represent the latest generation technology in substrate bonders offering precision performance and flexibility in a user-friendly, high-quality package. The newly designed and enhanced SB8e/6e are semi-automatic, computer-controlled systems with both vacuum- and pressurecontrolled atmosphere capability featuring an ergonomic load/ unload station. The SB8e/6e delivers superior post bond alignment accuracy resulting from precision mechanics, uniform force capability and leading temperature control. When matched with SUSS’ bond aligners, BA8/6, they offer enabling capability for MEMS, 3-D interconnects, and opto-electronics. This generation’s bond chamber and tooling supports all types of bond processes with optimization especially for thermocompression bonding and the flexibility to switch to anodic bond tooling. The flexibility of these bond systems make them ideal and economical for laboratories and small series production. Yet, combined with SUSS’ patent-pending low temperature plasma activation module these systems offer enabling technology for fusion bonding of SOI, III/V, and SiGe compounds at temperatures down to 200°C. Wafer Bonder