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6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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SUSS MicroTec / KARL SUSS SB6e
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The SB8e and the SB6e (SB8e/6e) represent the latest generation technology in substrate bonders offering precision performance and flexibility in a user-friendly, high-quality package. The newly designed and enhanced SB8e/6e are semi-automatic, computer-controlled systems with both vacuum- and pressurecontrolled atmosphere capability featuring an ergonomic load/ unload station. The SB8e/6e delivers superior post bond alignment accuracy resulting from precision mechanics, uniform force capability and leading temperature control. When matched with SUSS’ bond aligners, BA8/6, they offer enabling capability for MEMS, 3-D interconnects, and opto-electronics. This generation’s bond chamber and tooling supports all types of bond processes with optimization especially for thermocompression bonding and the flexibility to switch to anodic bond tooling. The flexibility of these bond systems make them ideal and economical for laboratories and small series production. Yet, combined with SUSS’ patent-pending low temperature plasma activation module these systems offer enabling technology for fusion bonding of SOI, III/V, and SiGe compounds at temperatures down to 200°C. Wafer Bonder
    Documents

    No documents

    SUSS MicroTec / KARL SUSS

    SB6e

    verified-listing-icon

    Verified

    CATEGORY
    Wafer Bonders

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    92361


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    SUSS MicroTec / KARL SUSS SB6e

    SUSS MicroTec / KARL SUSS

    SB6e

    Wafer Bonders
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    SUSS MicroTec / KARL SUSS

    SB6e

    verified-listing-icon
    Verified
    CATEGORY
    Wafer Bonders
    Last Verified: Over 60 days ago
    listing-photo-630924104aa949f7b403f0340db1ff75-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    92361


    Wafer Sizes:

    Unknown


    Vintage:

    Unknown


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The SB8e and the SB6e (SB8e/6e) represent the latest generation technology in substrate bonders offering precision performance and flexibility in a user-friendly, high-quality package. The newly designed and enhanced SB8e/6e are semi-automatic, computer-controlled systems with both vacuum- and pressurecontrolled atmosphere capability featuring an ergonomic load/ unload station. The SB8e/6e delivers superior post bond alignment accuracy resulting from precision mechanics, uniform force capability and leading temperature control. When matched with SUSS’ bond aligners, BA8/6, they offer enabling capability for MEMS, 3-D interconnects, and opto-electronics. This generation’s bond chamber and tooling supports all types of bond processes with optimization especially for thermocompression bonding and the flexibility to switch to anodic bond tooling. The flexibility of these bond systems make them ideal and economical for laboratories and small series production. Yet, combined with SUSS’ patent-pending low temperature plasma activation module these systems offer enabling technology for fusion bonding of SOI, III/V, and SiGe compounds at temperatures down to 200°C. Wafer Bonder
    Documents

    No documents

    Similar Listings
    View All
    SUSS MicroTec / KARL SUSS SB6e

    SUSS MicroTec / KARL SUSS

    SB6e

    Wafer BondersVintage: 0Condition: UsedLast Verified:Over 60 days ago
    SUSS MicroTec / KARL SUSS SB6e

    SUSS MicroTec / KARL SUSS

    SB6e

    Wafer BondersVintage: 0Condition: UsedLast Verified:Over 60 days ago
    SUSS MicroTec / KARL SUSS SB6e

    SUSS MicroTec / KARL SUSS

    SB6e

    Wafer BondersVintage: 0Condition: UsedLast Verified:Over 60 days ago