- 4" Fixture Gen I (looks like new / hardly used)
- System is currently set up for 4" wafers but is capable of 4"-6" wafer size
- Variant Turbo Pump for Vacuum
- Pressure Plate with center pin for Anodic Bonding (not installed but with the tool)
- 4" Closed Pressure Plate (no holes) for applying temperature and pressure. This type of plate is used for temperature compressed bonding.
- Heater Controller System
- Power Supply for negative high voltage -2000V and 15 mA
- Up to 20kN Bond Force
- HDD included
- PC is complete
- Windows 2000
- Monitor
- Mouse
- Operations Manual
- Screws are missing from heater contoller unit and PC so previous user may have taken components out for troubleshooting
- tool pressure gauge button missing
- Overpressure Control
- Overall, good condition tool that looks like it was not used frequently
- ACP40G Oil Pump included and hooked to the tool.

SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components.

SUSS MicroTec / KARL SUSS

The SB8e and the SB6e (SB8e/6e) represent the latest generation technology in substrate bonders offering precision performance and flexibility in a user-friendly, high-quality package. The newly designed and enhanced SB8e/6e are semi-automatic, computer-controlled systems with both vacuum- and pressurecontrolled atmosphere capability featuring an ergonomic load/ unload station. The SB8e/6e delivers superior post bond alignment accuracy resulting from precision mechanics, uniform force capability and leading temperature control. When matched with SUSS’ bond aligners, BA8/6, they offer enabling capability for MEMS, 3-D interconnects, and opto-electronics. This generation’s bond chamber and tooling supports all types of bond processes with optimization especially for thermocompression bonding and the flexibility to switch to anodic bond tooling. The flexibility of these bond systems make them ideal and economical for laboratories and small series production. Yet, combined with SUSS’ patent-pending low temperature plasma activation module these systems offer enabling technology for fusion bonding of SOI, III/V, and SiGe compounds at temperatures down to 200°C.

Wafer Bonder

SB6e

C846CD89-63B5-4456-A48A-A464CFFFCF8A_1_201_a.jpeg

FE8CC779-3C86-4A11-BD3C-F7F8B60FDA0E_1_201_a.jpeg

E8D16702-9A82-41D7-AFF1-022F96FD1EBD.png

BFC63BB4-005D-4D60-A900-499A3C57FDA9.png

9CA8398D-4983-485C-BA54-B7603A49882E.png

227591DC-682C-476C-AC80-38CF142F37AF.png

9220B417-27DA-4C9E-9BFE-5412C9A809F5.png

6EB10AF7-DE29-4EBD-9318-E6B98E3BC92C.png

CD7D57BE-D334-47F0-9CD5-B0E7CCF79E67.png

8CDF077B-D077-4B50-92CD-D59EA0ECCDF2.png

97C24C77-429E-4D5C-A426-9798F32A9F48.png

2DA54D58-4888-40E7-8EA0-B203A9643A91.png

C3719A11-35F6-4B5A-B0CF-9DC0A082AB29.png

0DA71CC4-BA94-478F-BE7F-4D164668E623_1_201_a.jpeg

BDD6603B-1713-425A-B132-E5117CA5E2D2_4_5005_c.jpeg

D480A2F1-2D86-4CE2-BB2A-FD0E8B16FF28.png

F9075C98-35A4-4FC2-9508-962255269C38.png

FE7EEB1C-4B94-4B61-97C8-247C61335E0A.png

51F60ADE-C169-4AC1-9669-AB848098D936.png

49B0CE8F-2EA4-430D-BDEC-690E1D9050A7.png

B7C15EA0-507A-4774-9FD2-90FC977B1C38_1_201_a.jpeg

0E3AAE2D-6D95-4003-BA4A-CD0211BDD2DF_1_201_a.jpeg

296DD5B5-1C2A-45DB-AD0D-3F639DCDA379_1_201_a.jpeg

SUSS MicroTec / KARL SUSS

SB6e

Wafer Bonders

Similar Listings

SUSS MicroTec / KARL SUSS

SB6e

SUSS MicroTec / KARL SUSS

SB6e

SB6e

Wafer Bonders

Similar Listings

SUSS MicroTec / KARL SUSS

SB6e

SUSS MicroTec / KARL SUSS

SB6e