Description
AUTOMATED PRODUCTION WAFER BONDING SYSTEMConfiguration
No ConfigurationOEM Model Description
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mmDocuments
No documents
SUSS MicroTec / KARL SUSS
ABC200
Verified
CATEGORY
Wafer Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
41224
Wafer Sizes:
8"/200mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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SUSS MicroTec / KARL SUSS
ABC200
CATEGORY
Wafer Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
41224
Wafer Sizes:
8"/200mm
Vintage:
2006
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
AUTOMATED PRODUCTION WAFER BONDING SYSTEMConfiguration
No ConfigurationOEM Model Description
Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mmDocuments
No documents