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6" Fab For Sale from Moov - Click Here to Learn More
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6" Fab For Sale from Moov - Click Here to Learn More
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SUSS MicroTec / KARL SUSS CBC200
    Description
    Wafer Bonder
    Configuration
    Wafer Bonder
    OEM Model Description
    Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mm
    Documents

    No documents

    SUSS MicroTec / KARL SUSS

    CBC200

    verified-listing-icon

    Verified

    CATEGORY
    Wafer Bonders

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    91012

    Wafer Sizes:

    8"/200mm

    Vintage:

    2013

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    SUSS MicroTec / KARL SUSS CBC200

    SUSS MicroTec / KARL SUSS

    CBC200

    Wafer Bonders
    Vintage: 2006Condition: Used
    Last VerifiedOver 60 days ago
    SUSS MicroTec / KARL SUSS CBC200

    SUSS MicroTec / KARL SUSS

    CBC200

    Wafer Bonders
    Vintage: 2013Condition: Used
    Last VerifiedOver 60 days ago
    SUSS MicroTec / KARL SUSS CBC200

    SUSS MicroTec / KARL SUSS

    CBC200

    Wafer Bonders
    Vintage: 2006Condition: Used
    Last VerifiedOver 60 days ago

    SUSS MicroTec / KARL SUSS

    CBC200

    verified-listing-icon
    Verified
    CATEGORY
    Wafer Bonders
    Last Verified: Over 60 days ago
    listing-photo-7e391bead4284fb5966bbb05ecbb3143-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    91012

    Wafer Sizes:

    8"/200mm

    Vintage:

    2013

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Wafer Bonder
    Configuration
    Wafer Bonder
    OEM Model Description
    Wafer Bonding + Bond Alignment + Cleaning + Metal Oxide Removal + Plasma Activation Up to 200 mm
    Documents

    No documents

    Similar Listings
    View All
    SUSS MicroTec / KARL SUSS CBC200

    SUSS MicroTec / KARL SUSS

    CBC200

    Wafer BondersVintage: 2006Condition: UsedLast Verified:Over 60 days ago
    SUSS MicroTec / KARL SUSS CBC200

    SUSS MicroTec / KARL SUSS

    CBC200

    Wafer BondersVintage: 2013Condition: UsedLast Verified:Over 60 days ago
    SUSS MicroTec / KARL SUSS CBC200

    SUSS MicroTec / KARL SUSS

    CBC200

    Wafer BondersVintage: 2006Condition: UsedLast Verified:Over 60 days ago