
Description
Automated Bonding SystemConfiguration
No ConfigurationOEM Model Description
The EVG560 automated wafer bonding system accepts up to four bond chambers with various bond chamber configuration options for all bonding processes and wafers up to 300 mm. Based on the same bond chamber design and incorporating the key features of EVG's manual bonding systems with enhanced process control and automation, the EVG560 bonder delivers high-yield production bonds. A robot handling system automatically loads and unloads the process chambers.Documents
Verified
CATEGORY
Wafer Bonders
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
145564
Wafer Sizes:
Unknown
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG560
CATEGORY
Wafer Bonders
Last Verified: 4 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
145564
Wafer Sizes:
Unknown
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available