Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops. Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes. Wafer BonderDocuments
No documents
EVGroup (EVG)
EVG850 TB
Verified
CATEGORY
Wafer Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
72682
Wafer Sizes:
6"/150mm
Vintage:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG850 TB
CATEGORY
Wafer Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
72682
Wafer Sizes:
6"/150mm
Vintage:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The fully automated temporary bonding system achieves the whole temporary bonding process – starting with temporary adhesive application, baking, alignment and bonding of the device wafer to the carrier wafer – within one automated tool. The equipment layout is modular as with all of EVG’s fully automated tools, meaning it can be throughput-optimized depending on the specific process. The optional inline metrology module allows total process monitoring and parameter optimization with feedback loops. Because of EVG’s open platform, different types of temporary bonding adhesives can be used, such as spin coat thermoplast, thermoset materials, or tapes. Wafer BonderDocuments
No documents