Description

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Configuration

Table Top Version. Manual wafer load substrate bonder Capable of fusion compression bonding Capable of thermal compression bonding Capable of anodic bonding Ideal for R&D and pilot production applications High-vacuum capable bond chamber Windows based control software and operation interface Wafer size: up to 6”/150mm capable Tooling included for 4" & 6" wafers (bond chucks and steel pressure inserts) Anodic tooling not included Max Bond Force: 7 kN Top side heater: 550°C max. in 1°C steps Bottom side heater: 550°C max. in 1°C steps Temperature uniformity: ± 1,5 %Turbo pump and controller Roughing pump Load/unload tool System computer, monitor, and keyboard PDF Operations Manual for EVG 501 Bonder

OEM Model Description

The EVG501 is a versatile and flexible wafer bonding system, capable of handling substrate sizes ranging from single chips to 150 mm (200 mm with a 200 mm bond chamber). It supports various wafer bonding processes, including anodic, glass frit, solder, eutectic, transient liquid phase, and direct bonding. The system's design allows for easy access to the bond chamber and tooling, enabling quick and straightforward retooling for different wafer sizes and processes. With a conversion time of less than 5 minutes, the EVG501 offers efficient and seamless transitions between different bonding applications, making it an ideal solution for diverse wafer bonding needs.