We value your privacy
We and our selected partners use cookies to enhance your browsing experience, serve personalized content, and analyze our traffic. By clicking "Accept All", you consent to our use of cookies. Read More
Description
Wafer CleanerConfiguration
No ConfigurationOEM Model Description
The EVG301 semi-automated single wafer cleaning system employs one cleaning station, which cleans wafers using standard DI-water rinse as well as megasonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding. Spinner chucks are available for different wafer and substrate sizes to allow easy setup for different processes.Documents
No documents
Verified
CATEGORY
Wafer Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
105003
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG301
CATEGORY
Wafer Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
105003
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Wafer CleanerConfiguration
No ConfigurationOEM Model Description
The EVG301 semi-automated single wafer cleaning system employs one cleaning station, which cleans wafers using standard DI-water rinse as well as megasonic, brush and diluted chemicals as additional cleaning options. With manual loading and pre-alignment, the EVG301 is a versatile R&D-type system for flexible cleaning procedures and 300 mm capability. The EVG301 system can be combined with EVG's wafer alignment and bonding systems to eliminate any particle prior to wafer bonding. Spinner chucks are available for different wafer and substrate sizes to allow easy setup for different processes.Documents
No documents