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EVGroup (EVG) EVG520 HE
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs. Wafer Bonder
    Documents

    No documents

    EVGroup (EVG)

    EVG520 HE

    verified-listing-icon

    Verified

    CATEGORY
    Wafer Bonders

    Last Verified: 7 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    116672

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
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    EVGroup (EVG) EVG520 HE

    EVGroup (EVG)

    EVG520 HE

    Wafer Bonders
    Vintage: 0Condition: Used
    Last Verified7 days ago

    EVGroup (EVG)

    EVG520 HE

    verified-listing-icon
    Verified
    CATEGORY
    Wafer Bonders
    Last Verified: 7 days ago
    listing-photo-6bbb28aa3d804293b22d965d8f550466-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/7998/6bbb28aa3d804293b22d965d8f550466/7a5cd208144141c0b109b4a7b6a26818_d4c55a2647a847f2afe891b1dd2c41ac1201a_mw.jpeg
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    listing-photo-6bbb28aa3d804293b22d965d8f550466-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/7998/6bbb28aa3d804293b22d965d8f550466/8b51606220f94f3ead94fff3e21b6d5f_82131de914894ef9ba2f93c3eee81afa1201a_mw.jpeg
    listing-photo-6bbb28aa3d804293b22d965d8f550466-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/7998/6bbb28aa3d804293b22d965d8f550466/3655f679f6524a96aa122c76231495e0_0aae74682ad94d8b9568cb4aa4f292b2_mw.jpeg
    listing-photo-6bbb28aa3d804293b22d965d8f550466-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/7998/6bbb28aa3d804293b22d965d8f550466/bbd79404bbdd4ba38fa96f996f59e8d5_cf0dceddcd7c46d7a95ebce84578f7891201a_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    116672

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs. Wafer Bonder
    Documents

    No documents

    Similar Listings
    View All
    EVGroup (EVG) EVG520 HE

    EVGroup (EVG)

    EVG520 HE

    Wafer BondersVintage: 0Condition: UsedLast Verified:7 days ago