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Description
No descriptionConfiguration
BonderOEM Model Description
The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs. Wafer BonderDocuments
No documents
Verified
CATEGORY
Wafer Bonders
Last Verified: 25 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled / Uncrated
Product ID:
116672
Wafer Sizes:
Unknown
Vintage:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG520 HE
CATEGORY
Wafer Bonders
Last Verified: 25 days ago
Key Item Details
Condition:
Used
Operational Status:
Deinstalled / Uncrated
Product ID:
116672
Wafer Sizes:
Unknown
Vintage:
2016
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
BonderOEM Model Description
The EVG520 HE is a cutting-edge semi-automated hot embossing system, specifically tailored for high-precision thermoplastic substrate imprinting. Capable of accommodating substrates up to 200 mm in diameter, it seamlessly integrates with industry-standard semiconductor manufacturing technologies. The system features high-vacuum and high-contact force capabilities, along with a universal embossing chamber, ensuring efficient and reliable processing. Its versatility allows for working with a comprehensive range of polymers suitable for hot embossing applications, making it an ideal choice for advanced manufacturing needs. Wafer BonderDocuments
No documents