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Description
WAFER BONDINGConfiguration
No ConfigurationOEM Model Description
GEMINI FB Automated Production Wafer Bonding System Wafer sizes up to 300 mm GEMINI FB (Fusion Bond) performs aligned direct bonding at room temperature and ambient pressure conditions. Because the initial bond is formed when the wafers are brought into contact in the aligner, there is no need for bond chambers. High throughput, best alignment accuracy and small footprint, combined with multiple pre-processing chambers, ensures best performance.Documents
No documents
Verified
CATEGORY
Wafer Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
107777
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
GEMINI FB
CATEGORY
Wafer Bonders
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
107777
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
WAFER BONDINGConfiguration
No ConfigurationOEM Model Description
GEMINI FB Automated Production Wafer Bonding System Wafer sizes up to 300 mm GEMINI FB (Fusion Bond) performs aligned direct bonding at room temperature and ambient pressure conditions. Because the initial bond is formed when the wafers are brought into contact in the aligner, there is no need for bond chambers. High throughput, best alignment accuracy and small footprint, combined with multiple pre-processing chambers, ensures best performance.Documents
No documents