Skip to main content
6" Fab For Sale from Moov - Click Here to Learn More
6" Fab For Sale from Moov - Click Here to Learn More
Moov logo

6" Fab For Sale from Moov - Click Here to Learn More
Moov Icon
EVGroup (EVG) GEMINI
    Description
    Waferbonder
    Configuration
    No Configuration
    OEM Model Description
    A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.
    Documents

    No documents

    EVGroup (EVG)

    GEMINI

    verified-listing-icon

    Verified

    CATEGORY
    Wafer Bonders

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    96158


    Wafer Sizes:

    6"/150mm


    Vintage:

    2015


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    EVGroup (EVG) GEMINI

    EVGroup (EVG)

    GEMINI

    Wafer Bonders
    Vintage: 2012Condition: Used
    Last VerifiedOver 60 days ago

    EVGroup (EVG)

    GEMINI

    verified-listing-icon
    Verified
    CATEGORY
    Wafer Bonders
    Last Verified: Over 60 days ago
    listing-photo-84d55b16bdde46d0b6ca9cba06bc58f4-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    96158


    Wafer Sizes:

    6"/150mm


    Vintage:

    2015


    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Waferbonder
    Configuration
    No Configuration
    OEM Model Description
    A maximum level of automation and process integration is achieved with the GEMINI automated production wafer bonding system. Wafer-to-wafer alignment and wafer bonding processes up to 200 mm (300 mm) for volume manufacturing are all performed in one fully automated platform. Device manufacturers benefit from increased production output, a high integration level and a wide choice of bonding process methods like anodic, silicon fusion, thermo-compression and eutectic bonding.
    Documents

    No documents

    Similar Listings
    View All
    EVGroup (EVG) GEMINI

    EVGroup (EVG)

    GEMINI

    Wafer BondersVintage: 2012Condition: UsedLast Verified:Over 60 days ago
    EVGroup (EVG) GEMINI

    EVGroup (EVG)

    GEMINI

    Wafer BondersVintage: 0Condition: UsedLast Verified:Over 60 days ago
    EVGroup (EVG) GEMINI

    EVGroup (EVG)

    GEMINI

    Wafer BondersVintage: 0Condition: UsedLast Verified:Over 60 days ago