Description
Provides precise, non-destructive thin film stress measurement via substrate curvature analysis, supporting process control, failure analysis, and R&D applications. Configured for wafer-based measurements with support for sizes up to approximately 200mm. Power: 115V / 1 Phase / 60HzConfiguration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents
Similar Listings
View All
KLA
FLX 2320A
CATEGORY
Thin Film / Film Thickness
Last Verified: 16 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
146114
Wafer Sizes:
8"/200mm
Vintage:
1993
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Provides precise, non-destructive thin film stress measurement via substrate curvature analysis, supporting process control, failure analysis, and R&D applications. Configured for wafer-based measurements with support for sizes up to approximately 200mm. Power: 115V / 1 Phase / 60HzConfiguration
No ConfigurationOEM Model Description
None ProvidedDocuments
No documents