Description
Film Stress Measurement System - Thin-film stress measurement instrument that measures the changes in the radius of curvature of a wafer caused by the deposition of a stressed thin film. - Laser scanning to measure stress on all reflecting films. - Measures and displays stress as a function of time or temperature. - Comprehensive data analysis capabilities that include trend plotting for statistical process control (SPC) and displaying a 3-D map of wafer deflection over the entire surface. - Used for calculation of biaxial modulus of elasticity and linear expansion, water diffusion coefficient in dielectric films, linear regression and stress-temp or stress-time gradients. - Provides analysis of thin film stress with very low measurement noise and allows observation and quantitative evaluation of stress relaxation, oxide densification, thin film phase transformations and annealing.Configuration
- Manual Wafer Load - Thin Film Stress Measurement System - Temperature: up to 500C - Dual Wavelength Technology - Operating System: MS-DOS V6.22 - Software Version 2.0 - Optional Upgrade Windows Pentium 3OEM Model Description
The Tencor FLX-2320 is an equipment that accurately measures film stress at temperatures from -65°C to 500°C, using dual wavelength technology to work on all types of films, including transparent ones like silicon nitride. This helps better understand film properties in simulated process environments.Documents
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KLA
FLX 2320
CATEGORY
Thin Film / Film Thickness
Last Verified: 6 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
152935
Wafer Sizes:
6"/150mm
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Film Stress Measurement System - Thin-film stress measurement instrument that measures the changes in the radius of curvature of a wafer caused by the deposition of a stressed thin film. - Laser scanning to measure stress on all reflecting films. - Measures and displays stress as a function of time or temperature. - Comprehensive data analysis capabilities that include trend plotting for statistical process control (SPC) and displaying a 3-D map of wafer deflection over the entire surface. - Used for calculation of biaxial modulus of elasticity and linear expansion, water diffusion coefficient in dielectric films, linear regression and stress-temp or stress-time gradients. - Provides analysis of thin film stress with very low measurement noise and allows observation and quantitative evaluation of stress relaxation, oxide densification, thin film phase transformations and annealing.Configuration
- Manual Wafer Load - Thin Film Stress Measurement System - Temperature: up to 500C - Dual Wavelength Technology - Operating System: MS-DOS V6.22 - Software Version 2.0 - Optional Upgrade Windows Pentium 3OEM Model Description
The Tencor FLX-2320 is an equipment that accurately measures film stress at temperatures from -65°C to 500°C, using dual wavelength technology to work on all types of films, including transparent ones like silicon nitride. This helps better understand film properties in simulated process environments.Documents
No documents