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6" Fab For Sale from Moov - Click Here to Learn More
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FSM / FRONTIER SEMICONDUCTOR RAMAN 360
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    Micro Raman system for lattice level strain and material composition measurement. High spectral resolution (0.02 cm-1) and sub micron lateral resolution. Measurement of through silicon via (TSV) keep out zone, local stress and composition profiling. Fully automated C2C system.
    Documents

    No documents

    FSM / FRONTIER SEMICONDUCTOR

    RAMAN 360

    verified-listing-icon

    Verified

    CATEGORY
    Thin Film / Film Thickness

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    89292

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
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    FSM / FRONTIER SEMICONDUCTOR RAMAN 360

    FSM / FRONTIER SEMICONDUCTOR

    RAMAN 360

    Thin Film / Film Thickness
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    FSM / FRONTIER SEMICONDUCTOR

    RAMAN 360

    verified-listing-icon
    Verified
    CATEGORY
    Thin Film / Film Thickness
    Last Verified: Over 60 days ago
    listing-photo-fd3cb40f99ea4671bdec8e6899976211-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    89292

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    Micro Raman system for lattice level strain and material composition measurement. High spectral resolution (0.02 cm-1) and sub micron lateral resolution. Measurement of through silicon via (TSV) keep out zone, local stress and composition profiling. Fully automated C2C system.
    Documents

    No documents

    Similar Listings
    View All
    FSM / FRONTIER SEMICONDUCTOR RAMAN 360

    FSM / FRONTIER SEMICONDUCTOR

    RAMAN 360

    Thin Film / Film ThicknessVintage: 0Condition: UsedLast Verified:Over 60 days ago