Description
FILM THICKNESS MEASUREMENTConfiguration
No ConfigurationOEM Model Description
The NanoSpec 9200 is an advanced film analysis system that provides DUV-visible spectroscopic reflectometry. It has a small footprint and high throughput, making it a highly efficient tool for analyzing film thickness and material optical constants. The system can handle both 150mm and 200mm wafers and is capable of measuring up to 200 wafers per hour. It features the latest generation spectroscopic reflectometer, pattern recognition, auto-focus, auto-positioning stage, and robotic wafer handling capabilities. This makes it a fast, reliable, compact, and cost-effective tool for volume production in the IC manufacturing industry.Documents
No documents
ONTO / NANOMETRICS / ACCENT / BIO-RAD
NANOSPEC 9200
Verified
CATEGORY
Thin Film / Film Thickness
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
78321
Wafer Sizes:
8"/200mm
Vintage:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ONTO / NANOMETRICS / ACCENT / BIO-RAD
NANOSPEC 9200
CATEGORY
Thin Film / Film Thickness
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
78321
Wafer Sizes:
8"/200mm
Vintage:
2001
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
FILM THICKNESS MEASUREMENTConfiguration
No ConfigurationOEM Model Description
The NanoSpec 9200 is an advanced film analysis system that provides DUV-visible spectroscopic reflectometry. It has a small footprint and high throughput, making it a highly efficient tool for analyzing film thickness and material optical constants. The system can handle both 150mm and 200mm wafers and is capable of measuring up to 200 wafers per hour. It features the latest generation spectroscopic reflectometer, pattern recognition, auto-focus, auto-positioning stage, and robotic wafer handling capabilities. This makes it a fast, reliable, compact, and cost-effective tool for volume production in the IC manufacturing industry.Documents
No documents