Description
Film thickness measuring instrumentConfiguration
No ConfigurationOEM Model Description
The NanoSpec 6100 is a tabletop film analysis system that provides fast and low-cost measurement capabilities for thin film metrology. It uses non-contact spectroscopic reflectometry to measure sites as small as 10µm in diameter on production wafers and can measure wafer substrates in the size range of 75 to 200mm and photomasks from 5 to 9 inches square. The system can measure film thickness in the range of 200Å - 20µm with the visible light source and 25Å - 20µm with an optional UV light source. The upper thickness range can be extended to 70µm with the thick film option. The system also has a motorized, precision x-y sample stage with a resolution of better than 1µm and a high-resolution color graphics display that provides contour and 3D film thickness mapping.Documents
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ONTO / NANOMETRICS / ACCENT / BIO-RAD
NANOSPEC 6100
Verified
CATEGORY
Thin Film / Film Thickness
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112620
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ONTO / NANOMETRICS / ACCENT / BIO-RAD
NANOSPEC 6100
CATEGORY
Thin Film / Film Thickness
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
112620
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Film thickness measuring instrumentConfiguration
No ConfigurationOEM Model Description
The NanoSpec 6100 is a tabletop film analysis system that provides fast and low-cost measurement capabilities for thin film metrology. It uses non-contact spectroscopic reflectometry to measure sites as small as 10µm in diameter on production wafers and can measure wafer substrates in the size range of 75 to 200mm and photomasks from 5 to 9 inches square. The system can measure film thickness in the range of 200Å - 20µm with the visible light source and 25Å - 20µm with an optional UV light source. The upper thickness range can be extended to 70µm with the thick film option. The system also has a motorized, precision x-y sample stage with a resolution of better than 1µm and a high-resolution color graphics display that provides contour and 3D film thickness mapping.Documents
No documents