Description
Four-pocket gun in the photo has not been rebuilt yet. INSTALL REQUIREMENTS: 100 amps 3 ph (proper grounding very important) Water cooling 80 psi clean dry air N2 for backfill (speeds up pump down time)Configuration
4 POCKET ELECTRON BEAM GUN CHA SR10 ELECTRON BEAM POWER SUPPLY AUTOTECH II VALVE CONTROLLER CTI 8 CRYOPUMP CTI COMPRESSOROEM Model Description
The CHA MARK 40 is a highly efficient and flexible vacuum deposition system that supports dual operation, including sputtering and evaporation processes. It is designed to handle moving substrates, allowing for continuous and precise deposition of thin films on various materials. The system offers exceptional film uniformity, although the results may depend on the specific fixture used.Documents
No documents
CHA
MARK 40
Verified
CATEGORY
Thermal Evaporators
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
60982
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
CHA
MARK 40
CATEGORY
Thermal Evaporators
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
60982
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Four-pocket gun in the photo has not been rebuilt yet. INSTALL REQUIREMENTS: 100 amps 3 ph (proper grounding very important) Water cooling 80 psi clean dry air N2 for backfill (speeds up pump down time)Configuration
4 POCKET ELECTRON BEAM GUN CHA SR10 ELECTRON BEAM POWER SUPPLY AUTOTECH II VALVE CONTROLLER CTI 8 CRYOPUMP CTI COMPRESSOROEM Model Description
The CHA MARK 40 is a highly efficient and flexible vacuum deposition system that supports dual operation, including sputtering and evaporation processes. It is designed to handle moving substrates, allowing for continuous and precise deposition of thin films on various materials. The system offers exceptional film uniformity, although the results may depend on the specific fixture used.Documents
No documents