Description
No descriptionConfiguration
This system is configured with a low volume load lock mounted on top of the process chamber. The load lock consists of a gate valve, adapter flange and motorized linear motion assembly. The 7 .5″ substrate table assembry is mounted within this low volume adapter. Two of the three cathodes are configured for RF magnetron co-sputtering and the third cathode is configured for DC magnetron sputtering. The system has one 7″ diameter rotating substrate stage capable of 5 to 100 RPM, and the stage has 300 watt RF biasing capability. This can also be used for etching the substrate. The system is configured for downmeam pressure control. The software program will run a complete recipe automatically, giving the customer a repeatable process every time.OEM Model Description
None ProvidedDocuments
Verified
CATEGORY
Thermal Evaporators
Last Verified: 20 days ago
Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
138431
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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Key Item Details
Condition:
Refurbished
Operational Status:
Unknown
Product ID:
138431
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available