Description
Fully automated wafer support system Frame-mounted wafer laser debonding and adhesive removal systemConfiguration
(Qty 6) load ports Configured for Taiko wafer debonding Process: IR laser degradation of the LTHC layer for glass carrier removal Loading / unloading: (Qty 2) FOUP stations / (Qty 2) Frame cassette stations Wafer handling: Returns processed wafers to the original cassette and slot Glass carrier handling: Robotic removal to a 25-piece FOUP Transfer system: Rotary table with vacuum chucks Adhesive removal: Peel tape unit with remaining-tape sensor monitoring Peel tape roll length: 100 m Recipe controls: Laser current, frequency and speed; peel speed and position profiles; frame orientation Identification: Wafer barcode / Glass QR code / Frame label reading Network: TCP/IP Specified throughput target: ≥20 wafers/hourOEM Model Description
None ProvidedDocuments
No documents
Verified
CATEGORY
Support Equipment
Last Verified: 5 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
154854
Wafer Sizes:
Unknown
Vintage:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SCIENTECH
Pyxis 3001-TDB
CATEGORY
Support Equipment
Last Verified: 5 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
154854
Wafer Sizes:
Unknown
Vintage:
2021
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Fully automated wafer support system Frame-mounted wafer laser debonding and adhesive removal systemConfiguration
(Qty 6) load ports Configured for Taiko wafer debonding Process: IR laser degradation of the LTHC layer for glass carrier removal Loading / unloading: (Qty 2) FOUP stations / (Qty 2) Frame cassette stations Wafer handling: Returns processed wafers to the original cassette and slot Glass carrier handling: Robotic removal to a 25-piece FOUP Transfer system: Rotary table with vacuum chucks Adhesive removal: Peel tape unit with remaining-tape sensor monitoring Peel tape roll length: 100 m Recipe controls: Laser current, frequency and speed; peel speed and position profiles; frame orientation Identification: Wafer barcode / Glass QR code / Frame label reading Network: TCP/IP Specified throughput target: ≥20 wafers/hourOEM Model Description
None ProvidedDocuments
No documents