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BESI Die Bond Datacon 2200 evo BESi Die Bonder ESEC 2007 SSI Plus BESI Die Bonder ESEC 2008xP Shinkawa Wire Bond UTC2000 Shinkawa Wire Bond UTC2000 ASM Wire bond Xpress GoCu ASM Wire bond ASM IHAWK XPRESS GOCUOEM Model Description
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LOT
EQUIPMENT
CATEGORY
Support Equipment
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
96715
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
BESI Die Bond Datacon 2200 evo BESi Die Bonder ESEC 2007 SSI Plus BESI Die Bonder ESEC 2008xP Shinkawa Wire Bond UTC2000 Shinkawa Wire Bond UTC2000 ASM Wire bond Xpress GoCu ASM Wire bond ASM IHAWK XPRESS GOCUOEM Model Description
None ProvidedDocuments
No documents