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VEECO / ULTRATECH AP200
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Ultratech AP200 is part of the AP200/300 family of lithography systems that delivers superior performance in terms of overlay, resolution, and side wall profile. These systems are highly automated and cost-effective, making them well-suited for applications such as copper pillar, fan-out, through-silicon via (TSV), and silicon interposer. The platform also has numerous application-specific features that enable next-generation packaging techniques, including enhanced warped wafer handling, dual side alignment, and optical focus.
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    Verified

    CATEGORY
    Steppers & Scanners

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    113478


    Wafer Sizes:

    8"/200mm


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    VEECO / ULTRATECH AP200

    VEECO / ULTRATECH

    AP200

    Steppers & Scanners
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    VEECO / ULTRATECH

    AP200

    verified-listing-icon
    Verified
    CATEGORY
    Steppers & Scanners
    Last Verified: Over 60 days ago
    listing-photo-41b34b83b8244fe4aba3bccf13d76d7e-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    113478


    Wafer Sizes:

    8"/200mm


    Vintage:

    Unknown


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    The Ultratech AP200 is part of the AP200/300 family of lithography systems that delivers superior performance in terms of overlay, resolution, and side wall profile. These systems are highly automated and cost-effective, making them well-suited for applications such as copper pillar, fan-out, through-silicon via (TSV), and silicon interposer. The platform also has numerous application-specific features that enable next-generation packaging techniques, including enhanced warped wafer handling, dual side alignment, and optical focus.
    Documents

    No documents

    Similar Listings
    View All
    VEECO / ULTRATECH AP200

    VEECO / ULTRATECH

    AP200

    Steppers & ScannersVintage: 0Condition: UsedLast Verified:Over 60 days ago
    VEECO / ULTRATECH AP200

    VEECO / ULTRATECH

    AP200

    Steppers & ScannersVintage: 0Condition: UsedLast Verified:Over 60 days ago
    VEECO / ULTRATECH AP200

    VEECO / ULTRATECH

    AP200

    Steppers & ScannersVintage: 0Condition: UsedLast Verified:Over 60 days ago