Description
Exposure (Normal) [InFO]Configuration
No ConfigurationOEM Model Description
The Ultratech AP300W is a type of stepper lithography system that belongs to the AP200/300 series of systems. These systems are built on Veeco’s Unity Platform™, which is customizable. The AP300W and other systems in the series are known for their excellent overlay, resolution, and side wall profile performance. They are also highly automated and cost-effective. The AP300W is particularly well-suited for applications such as copper pillar, fan-out, through-silicon via (TSV), and silicon interposer. The platform also includes many features that are specific to certain applications, which help to enable next-generation packaging techniques. Some of these features include enhanced handling of warped wafers, dual side alignment, and optical focus.Documents
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Verified
CATEGORY
Steppers & Scanners
Last Verified: 26 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
151298
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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VEECO / ULTRATECH
AP300W
CATEGORY
Steppers & Scanners
Last Verified: 26 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
151298
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Exposure (Normal) [InFO]Configuration
No ConfigurationOEM Model Description
The Ultratech AP300W is a type of stepper lithography system that belongs to the AP200/300 series of systems. These systems are built on Veeco’s Unity Platform™, which is customizable. The AP300W and other systems in the series are known for their excellent overlay, resolution, and side wall profile performance. They are also highly automated and cost-effective. The AP300W is particularly well-suited for applications such as copper pillar, fan-out, through-silicon via (TSV), and silicon interposer. The platform also includes many features that are specific to certain applications, which help to enable next-generation packaging techniques. Some of these features include enhanced handling of warped wafers, dual side alignment, and optical focus.Documents
No documents