Description

i-Line Wide-Field Stepper

Configuration

System Controller Make INNOTECH System Operating System Ruby Duck Software version V74.45A Wafer Size (inch) 12 Wafer Type Notch Track/Wafer Interface EFEM Track Type RORZE Track Model RAE-15630 Wafer Interface FOUP Auto Feeder Type IV Right Installation Type Stand-Alone Wafer Chuck Type DI chuck Wafer Chuck Material Silicon Carbide Reticle Size 6" Reticle Cassette Type Canon Reticle Changer Canon Additional Reticle Library Canon Power Receiving Box Internal Outlet Power Box YES Service Tool NO Chuck Maintenance Unit YES Optional Parts (RPC/EBR) NO Lamp Manufacturer USHIO Lamp Manufacturers: Ushio, Osram or Wacom CE Marked? YES CE Mark Declaration YES COCOM Sticker English SECS/GEM Capable YES E-Connectivity/Diagnostic NO Date of Last PM 2/13/2024 Adjustment/Check Available? YES ATP Available? YES System lifetime wafer count 600 Lamp Age (hours) 20 System Status Off-Line Can Produce Wafers as-is? YES Off-Line Date (if applicable) 2/14/2024 OEM Audit Available? NO 3rd Party Audit Available? NO Decontamination Report? NO All cabling present? YES Operation Manual English Inspection Sheet English Service Manual English Any Field Modifications? NO Pellicle Particle Checker 6" Reticle Barcode Reader Canon Cassette Barcode Reader 6" SAC Unit NO EMO Guard Ring YES Temperature Recorder NO 3 Phase Transformer NO # of Signal Tower Colors 3 Includes the CIS (CMOS Image Sensor) option, specific for CFA materials, which does go deeper in Wavelength to ~ 910nm, which is similar to TSA frontside alignment, but not backside alignment.

OEM Model Description

The FPA-5550iZ2 is a high productivity and high overlay accuracy i-line stepper made by Canon1. It offers a low cost Mix-&-Match lithography solution for advanced Logic, Memory and CMOS Image Sensor (CIS) fabrication and also supports growing demand for Internet-of-Things (IoT) device fabrication on both 200 and 300 mm wafers.