
Description
PLXM20 - Sistema de fotolitografia para exposição de lâminas de semicondutores cobertas com polímeros fotossensível usando luz ultravioleta e máscaras (retículos) para a fabricação de circuitos integrados eletrônicos. -Configuration
No ConfigurationOEM Model Description
DUV Step and Scan The PAS 5500/750F DUV Step-and-Scan system enables 130-nm mass production using mature 248-nm KrF technology. It combines the imaging power of the improved 0.7 NA 4x reduction lens with the latest multi-spot innovations in the leveling system and the AERIAL II illumination technology including QUASAR, multipole illumination and optional multiple exposure capability. The system is equipped with both TTL alignment and ATHENA for improved alignment accuracy on backend process layers, providing a long term single machine overlay of less than 25 nm.Documents
No documents
Verified
CATEGORY
Steppers & Scanners
Last Verified: 12 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
149301
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ASML
PAS 5500/750F
CATEGORY
Steppers & Scanners
Last Verified: 12 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
149301
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
PLXM20 - Sistema de fotolitografia para exposição de lâminas de semicondutores cobertas com polímeros fotossensível usando luz ultravioleta e máscaras (retículos) para a fabricação de circuitos integrados eletrônicos. -Configuration
No ConfigurationOEM Model Description
DUV Step and Scan The PAS 5500/750F DUV Step-and-Scan system enables 130-nm mass production using mature 248-nm KrF technology. It combines the imaging power of the improved 0.7 NA 4x reduction lens with the latest multi-spot innovations in the leveling system and the AERIAL II illumination technology including QUASAR, multipole illumination and optional multiple exposure capability. The system is equipped with both TTL alignment and ATHENA for improved alignment accuracy on backend process layers, providing a long term single machine overlay of less than 25 nm.Documents
No documents